R2R‐Based Continuous Production of Patterned and Multilayered Elastic Substrates with Liquid Metal Wiring for Stretchable Electronics

Author:

Kawakami Hiroki1ORCID,Nagatake Kyohei1,Ni Sijie1,Nakamura Fumika1,Takano Tamami1,Murakami Koki1,Ohara Ibuki1,Isano Yuji1,Matsuda Ryosuke1,Suwa Hideki1,Higashi Ryunosuke1,Kanto Moeka2,Saito Masato3,Fujita Hajime3,Araki Takuto45,Ozaki Shingo6,Ueno Kazuhide24,Horii Tatsuhiro3,Fujie Toshinori37,Ota Hiroki189ORCID

Affiliation:

1. Department of Mechanical Engineering Yokohama National University 79‐5 Tokiwadai, Hodogaya‐ku Yokohama Kanagawa 240‐8501 Japan

2. Department of Chemistry and Life Science Yokohama National University 79‐5 Tokiwadai, Hodogaya‐ku Yokohama Kanagawa 240‐8501 Japan

3. Department of Life Science and Technology Tokyo Institute of Technology 4259 Nagatsuta‐cho, Midori‐ku Yokohama Kanagawa 226‐8501 Japan

4. Institute of Advanced Science Yokohama National University 79‐5 Tokiwadai, Hodogaya‐ku Yokohama Kanagawa 240‐8501 Japan

5. Faculty of Engineering Yokohama National University 79‐5 Tokiwadai, Hodogaya‐ku Yokohama Kanagawa 240‐8501 Japan

6. Division of System Research, Faculty of Engineering Yokohama National University 79‐5 Tokiwadai, Hodogaya‐ku Yokohama Kanagawa 240‐8501 Japan

7. Research Center for Autonomous Systems Materialogy (ASMat) Institute of Innovative Research Tokyo Institute of Technology R3‐23, 4259 Nagatsuta‐cho, Midori‐ku Yokohama Kanagawa 226‐8501 Japan

8. Graduate School of System Integration Yokohama National University 79‐5 Tokiwadai, Hodogaya‐ku Yokohama Kanagawa 240‐8501 Japan

9. Institute for Multidisciplinary Sciences Yokohama National University 79‐5 Tokiwadai, Hodogaya‐ku Yokohama Kanagawa 240‐8501 Japan

Abstract

AbstractThe roll‐to‐roll (R2R) process for fabricating elastic substrates is essential for the social implementation of next‐generation stretchable devices with soft interfaces. In recent years, there is a growing demand for soft heterostructures with multiple monolithically patterned organic materials. However, a continuous processing technique for substrates with heterostructures patterned using highly stretchable wiring has not yet been developed. Conventional manufacturing methods for stretchable electronics lack production capacity. This study introduces an R2R‐based method for the continuous production of multilayered substrates composed of various elastic materials, integrated with liquid metal (LM) wiring, suitable for stretchable electronics. Continuous fabrication of polymer films is achieved with pattern areas as small as 0.78 mm2, using three different polymers varying in hardness. The R2R coating process, paired with liquid metal wiring dispensing printing, allows for the creation of lines as fine as 140 microns. This process supports the batch production of 15 stretchable hybrid devices at a time and enables the creation of large‐area devices up to 400 cm2. The fabrication technique developed herein holds promise for the future manufacturing of not only stretchable electronics but also cutting‐edge soft electronics like smart packaging. This is expected to be a factor leading to the commercialization of stretchable electronics.

Funder

Precursory Research for Embryonic Science and Technology

Publisher

Wiley

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