Affiliation:
1. Wuhan National Laboratory for Optoelectronics (WNLO) School of Optical and Electronic Information (SOEI) Huazhong University of Science and Technology Wuhan Hubei 430074 P. R. China
2. China‐EU Institute for Clean and Renewable Energy Huazhong University of Science and Technology Wuhan Hubei 430074 P. R. China
3. Beijing National Laboratory for Molecular Sciences Key Laboratory of Molecular Nanotechnology Institute of Chemistry Chinese Academy of Sciences Beijing 100190 P. R. China
Abstract
AbstractShort‐wave infrared detectors are increasingly important in the fields of autonomous driving, food safety, disease diagnosis, and scientific research. However, mature short‐wave infrared cameras such as InGaAs have the disadvantage of complex heterogeneous integration with complementary metal–oxide–semiconductor (CMOS) readout circuits, leading to high cost and low imaging resolution. Herein, a low‐cost, high‐performance, and high‐stability TexSe1–x short‐wave infrared photodiode detector is reported. The TexSe1–x thin film is fabricated through CMOS‐compatible low‐temperature evaporation and post‐annealing process, showcasing the potential of direct integration on the readout circuit. The device demonstrates a broad‐spectrum response of 300–1600 nm, a room‐temperature specific detectivity of 1.0 × 1010 Jones, a −3 dB bandwidth up to 116 kHz, and a linear dynamic range of over 55 dB, achieving the fastest response among Te‐based photodiode devices and a dark current density 7 orders of magnitude smaller than Te‐based photoconductive and field‐effect transistor devices. With a simple Si3N4 packaging, the detector shows high electric stability and thermal stability, meeting the requirements for vehicular applications. Based on the optimized TexSe1–x photodiode detector, the applications in material identification and masking imaging is demonstrated. This work paves a new way for CMOS‐compatible infrared imaging chips.
Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by
18 articles.
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