Biodegradable Electronic Systems in 3D, Heterogeneously Integrated Formats-Reference-Cited by-全球学者库

Biodegradable Electronic Systems in 3D, Heterogeneously Integrated Formats

Published:2018-01-19 Issue:11 Volume:30 Page:1704955
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Chang Jan-Kai¹^ORCID,Chang Hui-Ping²³,Guo Qinglei³⁴,Koo Jahyun¹,Wu Chih-I²,Rogers John A.¹⁵

Affiliation:

1. Center for Bio-Integrated Electronics; Northwestern University; Evanston IL 60208 USA

2. Institute of Photonics and Optoelectronics; National Taiwan University; Taipei 10617 Taiwan

3. Frederick Seitz Materials Research Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

4. Department of Materials Science; Fudan University; Shanghai 200433 P. R. China

5. Department of Materials Science and Engineering; Department of Biomedical Engineering; Department of Neurological Surgery; Department of Chemistry; Department of Mechanical Engineering; Department of Electrical Engineering; and Department of Computer Science; Simpson Querrey Institute; Feinberg Medical School; Northwestern University; Evanston IL 60208 USA

Funder

University of Illinois

National Taiwan University

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference61 articles.

1. A Physically Transient Form of Silicon Electronics

2. Transient Electronics: Materials and Devices

3. Recent development of transient electronics

4. Organic Thin-Film Transistors Fabricated on Resorbable Biomaterial Substrates

5. High-Performance Biodegradable/Transient Electronics on Biodegradable Polymers

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