An Epidermal Stimulation and Sensing Platform for Sensorimotor Prosthetic Control, Management of Lower Back Exertion, and Electrical Muscle Activation-Reference-Cited by-同舟云学术

An Epidermal Stimulation and Sensing Platform for Sensorimotor Prosthetic Control, Management of Lower Back Exertion, and Electrical Muscle Activation

Published:2015-10-15 Issue:22 Volume:28 Page:4462-4471
ISSN:0935-9648
Container-title:Advanced Materials
language:en
Short-container-title:Adv. Mater.

Author:

Xu Baoxing¹²,Akhtar Aadeel³,Liu Yuhao²,Chen Hang⁴⁵,Yeo Woon-Hong²⁶,Park Sung II²,Boyce Brandon⁷,Kim Hyunjin²,Yu Jiwoo²,Lai Hsin-Yen²,Jung Sungyoung²,Zhou Yuhao²,Kim Jeonghyun²,Cho Seongkyu²,Huang Yonggang⁵,Bretl Timothy⁷,Rogers John A.²

Affiliation:

1. Department of Mechanical and Aerospace Engineering; University of Virginia; Charlottesville VA 22904 USA

2. Department of Materials Science and Engineering; Beckman Institute, and Frederick Seitz Materials Research Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

3. Neuroscience Program; Medical Scholars Program; Beckman Institute, and Coordinated Science Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

4. Department of Engineering Mechanics and Center for Mechanics and Materials; Tsinghua University; Beijing 100084 China

5. Department of Mechanical Engineering and Department of Civil and Environmental Engineering; Center for Engineering and Healthand Skin Disease Research Center; Northwestern University; Evanston IL 60208 USA

6. Department of Mechanical and Nuclear Engineering; Center for Rehabilitation Science and Engineering; Virginia Commonwealth University; Richmond VA 23284 USA

7. Department of Aerospace Engineering; Beckman Institute, and Coordinated Science Laboratory; University of Illinois at Urbana-Champaign; Urbana IL 61801 USA

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference46 articles.

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5. Materials and Optimized Designs for Human-Machine Interfaces Via Epidermal Electronics

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