Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages-Reference-Cited by-同舟云学术

Transient Liquid Phase Bonding of AlN to AlSiC for Durable Power Electronic Packages

Published:2018-06-12 Issue:10 Volume:20 Page:1800039
ISSN:1438-1656
Container-title:Advanced Engineering Materials
language:en
Short-container-title:Adv. Eng. Mater.

Author:

Pahinkar Darshan G.¹,Puckett Waylon¹,Graham Samuel¹,Boteler Lauren²,Ibitayo Dimeji²,Narumanchi Sreekant³,Paret Paul³,DeVoto Douglas³,Major Joshua³

Affiliation:

1. Electronics Manufacturing and Reliability Laboratory; GWW School of Mechanical Engineering; Georgia Institute of Technology; 771 Ferst Drive NW Atlanta GA 30332 USA

2. U.S. Army Research Laboratory; Adelphi MD 20783 USA

3. National Renewable Energy Laboratory; Golden CO 80401 USA

Publisher

Wiley

Subject

Condensed Matter Physics,General Materials Science

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/adem.201800039/fullpdf

Reference21 articles.

1. D. DeVoto M. Mihalic T. Popp S. Narumanchi 2011

2. L. Dupont M.S. Thesis 2006

3. Thermal fatigue and failure of electronic power device substrates

4. Y. Kuromitsu Y. Nagatomo H. Tonomuru K. Akiyama C. M. Montesa N. Shibata Y. Ikuhara Int. Conf. Integr. Power Electron. Syst 2010

5. Direct bonding of copper to aluminum nitride

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