Recent Advances on 3D Printing Technique for Thermal-Related Applications
Author:
Affiliation:
1. High-Performance Materials Institute (HPMI), FAMU-FSU College of Engineering, Florida State University; Tallahassee USA
Funder
NSF Scalable Nanomanufacturing Program
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Reference68 articles.
1. Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions
2. Research on the reduction of sink mark and warpage of the molded part in rapid heat cycle molding process
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