Stitch bond strength study in insulated Cu wire bonding-Reference-Cited by-同舟云学术

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Stitch bond strength study in insulated Cu wire bonding

Published:2014-12-05 Issue:sup6 Volume:18 Page:S6-264-S6-268
ISSN:1432-8917
Container-title:Materials Research Innovations
language:en
Short-container-title:Materials Research Innovations

Author:

Leong H. Y.¹,Yap B. K.¹,Khan N.²,Ibrahim M. R.²,Tan L. C.²,Faiz M.³

Affiliation:

1. Centre for Microelectronic and Nano EngineeringCOE, Universiti Tenaga Nasional, KM7 Jalan Ikram-Uniten, 43009 Kajang, Selangor, Malaysia

2. Freescale Semiconductor Malaysia Sdn. Bhd., Free Industrial Zone Sungai Way, 47300 Petaling Jaya, Selangor, Malaysia

3. Department of Mechanical EngineeringFaculty of Engineering Building, University of Malaya, 50603 Kuala Lumpur, Malaysia

Publisher

Informa UK Limited

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.tandfonline.com/doi/pdf/10.1179/1432891714Z.0000000001018

Reference10 articles.

1. A new bonding-tool solution to improve stitch bondability

2. Overview of wire bonding using copper wire or insulated wire

3. Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding

4. Challenges and developments of copper wire bonding technology

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of Transmission Performance for Fine Pitch Interconnect;Solid State Phenomena;2023-05-30

2. Effect of welding parameters on resistance thermocompression microwelded joint of insulated copper wire;Welding in the World;2021-02-01

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