Thermal-aware task scheduling at the system software level
Author:
Affiliation:
1. IBM T.J. Watson Research center, Yortown Heights, NY
Publisher
ACM
Link
https://dl.acm.org/doi/pdf/10.1145/1283780.1283826
Reference19 articles.
1. International Technology Roadmap for Semiconductors 2005. International Technology Roadmap for Semiconductors 2005.
2. A global wiring paradigm for deep submicron design
3. A power-optimal repeater insertion methodology for global interconnects in nanometer designs
4. Power estimation in global interconnects and its reduction using a novel repeater optimization methodology
5. Practical repeater insertion for low power
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