Optimization Of Hybrid Composite Laminates With Various Materials Using GA/GPSA Hybrid Algorithm for Maximum Dimensional Stability

Author:

Geçmez Hacer1ORCID,Deveci Hamza Arda1ORCID

Affiliation:

1. ERZİNCAN BİNALİ YILDIRIM ÜNİVERSİTESİ

Abstract

In this study, it is aimed to obtain the highest dimensional stability against temperature changes in fiber-reinforced hybrid composite laminates considering eight different composite materials: Aramid/Epoxy, AS4/Epoxy, Boron/Epoxy, E-Glass/Epoxy, IM6/Epoxy, GY70/Epoxy, Kevlar49/Epoxy, and Spectra/Epoxy. The study focuses on finding the optimum continuous and traditional fiber angle orientations for the hybrid composite plates that would provide the lowest coefficients of thermal expansion. For this purpose, two different laminate sequences were investigated, each including two materials. A hybrid algorithm combining genetic algorithm and generalized pattern search algorithm was used in the optimization. A great number of hybrid design problems were solved repeatedly, and their results were compared both within themselves and to the optimum non-hybrid laminate results. Furthermore, the thermal durability of the selected optimum hybrid designs was evaluated by Tsai-Wu failure and Hashin-Rotem criteria. The results reveal that substantial increase in dimensional stability can be achieved by stacking sequence optimization of hybrid composite laminates with multiple material selection, and this hybrid design approach can offer the desired laminated composite structures for aerospace applications required to withstand extreme temperature changes.

Publisher

Bitlis Eren Universitesi Fen Bilimleri Dergisi

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3