Process standardization of infrared assisted pulsed microwave baked biscuits and its comparison with conventionally baked biscuits

Abstract

AbstractThe present research work was undertaken for process standardization of infrared (IR) and pulsed microwave (MW) assisted baking of biscuits with respect to physiochemical properties in order to reduce process time. Variables were IR baking temperature, IR baking time, MW baking power along with pulsed ON time. However, pulsed OFF time was kept constant at 15 s with three number of cycles for baking. The optimize value for maximum desirability of developed biscuits were 210°C IR baking temperature, 184.2 s IR baking time, 960 W MW baking power and 20 s MW baking ON time resulted in IR‐MW biscuits with 15.1 color difference, 5.96% spread ratio, 3.86% wb moisture content, 159.2 N hardness, 0.26 cohesiveness, 0.32 springiness, 054% free fatty acid, and 7.42 sensory acceptability. Significant (p < 0.05) effect of process parameters was found on all responses for developed wheat flour based biscuits. Biscuits developed at optimum conditions of IR assisted MW baking were compared with conventionally baked one with respect to spread ratio (%), hardness (N), and microscopic structure. IR assisted MW baked biscuits were found superior in quality and took 77% lesser time than conventional baking.Practical ApplicationsThis study results that energy conservation and baking time can be reduced by using infrared assisted pulsed microwave baking technique. Minimizing the processing time, minimize the exposure of food to heat leads to less nutrient loss. This newer food‐processing technology has the potential to reduce the baking time up to 77% which can be beneficial for the baking industry along with reduction in energy conservation, it is in favor at economical level as well. In the combined infrared microwave heating method, microwave heating is used to accelerate the entire baking process, while infrared heating is utilized to promote browning and crisping reactions on the product surfaces.