Anisotropic Microstructural Development During the Constrained Sintering of Dip‐Coated Alumina Thin Films

Abstract

Alumina thin films were manufactured from aqueous slurries by dip coating. Film thickness as function of substrate withdrawal velocity could be correctly modeled by Landau and Levich's theory. Samples were sintered on a rigid substrate at 1350°C for different isothermal times to achieve relative densities from 84% to 97%. Microstructural analysis of polished cross sections revealed a continuous development of pore alignment, as expected by theoretical considerations. With increasing density pores become more anisometric and orientate along the thickness direction. A further preferential orientation of pores was found in the normal plane, apparently due to the coating process. Constraining conditions had less influence on the size and shape of the grains; they tend to become more equiaxed in the constrained plane, presumably due to the biaxial tensile stress state.