Author:
Kumar C. J. Dileep,Sowmya T. K.,Sunny E. K.,Raghu N.,Venkataramani N.,Kulkarni Ajit R.
Subject
Materials Chemistry,Ceramics and Composites
Reference44 articles.
1. 1 Y. Shimada , Y. Yamashita , and H. Takamizawa , “Low Dielectric Constant Multilayer Glass-Ceramic Substrate with Ag-Pd Wiring for VLSI Package,” IEEE Trans. Comp., Hybrids, Manuf. Technol., 11 [1] 163-70 (1988).
2. 2 R. R. Tummala , “Ceramics and Glass Ceramics Packaging in 1990s,” J. Am. Ceram. Soc., 74 [5] 895-908 (1991).
3. 3 S. H. Knickerbocker , A. H. Kumar , and L. W. Herron , “Cordierite Glass-Ceramics for Multilayer Ceramic Packaging,” Am. Ceram. Soc. Bull., 72 [1] 90-5 (1993).
4. 5 J. H. Jean , S. C. Lin , and C. R. Chang , “Low-Temperature, Low-Dielectric, Crystallizable Glass Composite,” IEEE Tarns. Comp., Pack., Manufac. Technol. Part-B, 18 [4] 751-4 (1995).
Cited by
37 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献