From silicon shield to carbon lock‐in? The environmental footprint of electronic components manufacturing in Taiwan (2015–2020)

Author:

Roussilhe Gauthier1ORCID,Pirson Thibault2ORCID,Xhonneux Mathieu2ORCID,Bol David2ORCID

Affiliation:

1. RMIT Royal Melbourne Institute of Technology Melbourne Australia

2. ICTEAM Université catholique de Louvain Louvain‐la‐Neuve Belgium

Abstract

AbstractTaiwan plans to rapidly increase its industrial production capacity of electronic components while concurrently setting policies for its ecological transition. Given that the island is responsible for the manufacturing of a significant part of worldwide electronics components (including the most advanced CMOS technology nodes), the sustainability of the Taiwanese electronics industry is of critical interest. In this paper, we survey the environmental footprint of 16 Taiwanese electronic components manufacturers (ECMs) using corporate sustainability responsibility reports. Based on data from 2015 to 2020, we find out that the sample of ECMs in this study increased its greenhouse gas emissions by 7.5% per year, its final energy and electricity consumption by 8.8% and 8.9%, and its water usage by 6.1%. We show that the volume of manufactured electronic components and the environmental footprint compiled in this study are strongly correlated, which suggests that relative efficiency gains are not sufficient to curb the overall environmental footprint of ECMs on the island. Given the critical nature of the electronics industry for Taiwan's geopolitics and economics, the observed increase of energy consumption, and the slow renewable energy roll‐out, Taiwan could face a carbon lock‐in situation which will most likely prevent the achievement of carbon reduction goals and sustainability policies on the island.

Funder

European Regional Development Fund

Publisher

Wiley

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