High-Thermal-Conductivity Aluminum Nitride Ceramics: The Effect of Thermodynamic, Kinetic, and Microstructural Factors-Reference-Cited by-同舟云学术

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High-Thermal-Conductivity Aluminum Nitride Ceramics: The Effect of Thermodynamic, Kinetic, and Microstructural Factors

Published:2005-01-21 Issue:6 Volume:80 Page:1421-1435
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:

Author:

Jackson T. Barrett,Virkar Anil V.,More Karren L.,Dinwiddie Ralph B.,Cutler Raymond A.

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1997.tb03000.x/fullpdf

Reference49 articles.

1. Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Microcircuits;Werdecker;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1984

2. AlN Substrates with High Thermal Conductivity;Kurokawa;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1985

3. Metallized Aluminum Nitride Ceramics-Potential, Properties, Applications;Brunner;Interceram,1988

4. Aluminum Nitride Ceramics for Substrates;Ichinose;Mater. Sci. Forum,1988

5. High Thermal Conductivity Aluminum Nitride Ceramic Substrates and Packages;Miyashiro;IEEE Trans. Compon., Hybrids, Manuf. Technol.,1990

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