Structure-Based Huge Hard-Spring Torsional Resonator Coupled with Thermal Bending for Infrared Sensor-Reference-Cited by-同舟云学术

Structure-Based Huge Hard-Spring Torsional Resonator Coupled with Thermal Bending for Infrared Sensor

Published:2020-09-01 Issue:9 Volume:140 Page:240-245
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Okamoto Masaki¹,Hatagaki Tomoya¹,Kumagai Shinya²,Sasaki Minoru¹

Affiliation:

1. Department of Advanced Science and Technology, Toyota Technological Institute

2. Meijo University

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

https://www.jstage.jst.go.jp/article/ieejsmas/140/9/140_240/_pdf

Reference19 articles.

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2. (2) M. Vollmer and K.-P. Mollmann : “Infrared Thermal Imaging”, Wiley-VCH, pp. 498-503 (2010)

3. (3) B. E. Cole, R. E. Higashi, and R. A. Wood : “Monolithic two-dimensional arrays of micromachined microstructures for infrared applications”, Proc. IEEE, Vol. 86, No. 8, pp. 1679-1686 (1998)

4. (4) H. Zhou, P. Kropelnicki, J. M. Tsai, and C. Lee : “Development of a thermopile infrared sensor using stacked double polycrystalline silicon layers based on the CMOS process”, J. Micromech. Microeng., Vol. 23, p. 065026 (2013)

5. (5) C. Cabuz, S. Shoji, K. Fukatsu, E. Cabuz, K. Minami, and M. Esashi : “Fabrication and packaging of a resonant infrared sensor integrated in silicon”, Sens. Act. A, Vol. 43, pp. 92-99 (1994)

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