Author:
Jones Andrew. H.,Foley Brian. M.,Kirch Jeremy D.,Zhang Shuqi,Botez Dan,Mawst Luke. J.
Abstract
We investigate the use of steady-state thermoreflectance as a hitherto unexplored method of QCL evaluation via material characterization of the material thermal conductivity. We demonstrate the effectiveness of this approach for quantitative thermal characterization of post-fabrication QCL epitaxy at the sub-micron scale.