Very large spot size effect in nanosecond laser drilling efficiency of silicon
Author:
Publisher
The Optical Society
Subject
Atomic and Molecular Physics, and Optics
Reference14 articles.
1. Analysis of silicon via hole drilling for wafer level chip stacking by UV laser
2. Implementation of three-dimensional SOI-MEMS wafer-level packaging using through-wafer interconnections
3. Systematic Optimisation of Process Parameters in Laser Drilling of 200 µm Photovoltaic Silicon Wafers Using New Kind of Nanosecond IR Lasers
4. Silicon-on-diamond material by pulsed laser technique
5. Nd-YAG laser microvia drilling for interconnection application
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