Characterisation of thermal diode panels for use in the cooling season in buildings-Reference-Cited by-同舟云学术

Characterisation of thermal diode panels for use in the cooling season in buildings

Published:2002-03 Issue:3 Volume:34 Page:227-235
ISSN:0378-7788
Container-title:Energy and Buildings
language:en
Short-container-title:Energy and Buildings

Author:

Varga Szabolcs,Oliveira Armando C,Afonso Clito F

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Building and Construction,Civil and Structural Engineering

Reference15 articles.

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3. Development of a heat pipe thermal diode and its heat transport performance;Ochi;JSME International Journal,1996

4. L.J. Segerlind, Applied Finite Element Analysis, 2nd Edition, Wiley, New York, 1984.

5. S.V. Patankar, Numerical Heat Transfer And Fluid Flow, Hemisphere, 1980.

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