The thermal stability of nanocrystalline copper cryogenically milled with tungsten-Reference-Cited by-同舟云学术

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The thermal stability of nanocrystalline copper cryogenically milled with tungsten

Published:2012-12 Issue: Volume:558 Page:226-233
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Atwater Mark A.,Roy Debdas,Darling Kristopher A.,Butler Brady G.,Scattergood Ronald O.,Koch Carl C.

Funder

Office of Naval Research

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference51 articles.

1. Reducing grain boundary, dislocation line and vacancy formation energies by solute segregation. I. Theoretical background

2. Molecular dynamics simulations of grain size stabilization in nanocrystalline materials by addition of dopants

3. Alloy effects in nanostructures

4. Surface energy and solute strain energy effects in surface segregation

5. Stabilization of nanocrystalline grain sizes by solute additions

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