Elasticity study of very thin Cu films
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. An introduction to Cu electromigration
3. Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
4. Effect of the Tantalum Barrier Layer on the Electromigration and Stress Migration Resistance of Physical-Vapor-Deposited Copper Interconnect
5. DEFECT STUDIES OF THIN LAYERS BY THE VIBRATING-REED TECHNIQUE
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