Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation-Reference-Cited by-同舟云学术

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Hardness profiles of Sn-3.0Ag-0.5Cu-TiO2 composite solder by nanoindentation

Published:2016-07 Issue: Volume:669 Page:178-186
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Yahaya Muhamad Zamri,Ani Fakhrozi Che,Samsudin Zambri,Sahin Salim,Abdullah Mohd Zulkifly,Mohamad Ahmad Azmin

Funder

USM-RUI

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference25 articles.

1. Effect of rare earth on mechanical creep–fatigue property of SnAgCu solder joint

2. Effects of Ti addition to Sn–Ag and Sn–Cu solders

3. Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder

4. Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads

5. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process

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1. Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance;Journal of Materials Research and Technology;2024-09

2. Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder;Journal of Materials Science: Materials in Electronics;2024-07

3. Improved shear property of Sn-3.0Ag-0.5Cu/Ni micro solder joints under thermal shock between 77 K and 423 K by adding TiO2 nanoparticles;Journal of Materials Research and Technology;2024-03

4. Reliability improvement of SnAgCu interconnections under extreme temperature condition by TiO2 nanoparticles doping: Experiments and first principles calculations;Materials Characterization;2024-01

5. Thermal cycle reliability and creep behavior of nano-IMC mixed solder joints;Journal of Materials Science: Materials in Electronics;2023-10

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