Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Lead-free Solders in Microelectronics
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-Ag
4. A study on the reaction between Cu and Sn3.5Ag solder doped with small amounts of Ni
5. Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability
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4. Solder Reaction with Cu Alloy C7025 and Its Effect on Solder Joint Reliability;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
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