Strain-rate sensitivity, activation volume and mobile dislocations exhaustion rate in nanocrystalline Cu–11.1at%Al alloy with low stacking fault energy-Reference-Cited by-同舟云学术

Strain-rate sensitivity, activation volume and mobile dislocations exhaustion rate in nanocrystalline Cu–11.1at%Al alloy with low stacking fault energy

Published:2014-08 Issue: Volume:611 Page:274-279
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Huang C.X.,Hu W.P.,Wang Q.Y.

Funder

National Natural Science Foundation of China

Program for New Century Excellent Talents in University

Outstanding Young Scholars of Sichuan University

Alexander von Humboldt-Stiftung

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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5. Further comments on “mobile dislocations during stress relaxation in an Fe-0.056 wt.% Ti alloy” by K. Okazaki, Y. Aono and M. Kagawa

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