Constitutive modeling of shape memory polymer based self-healing syntactic foam
Author:
Funder
NASA/EPSCoR
NSF
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation
Reference47 articles.
1. Castable, sprayable, low density foam and composites for furniture, marble, marine;Anderson;J. Cell. Plast.,1970
2. Enthalpy relaxation of polymers: comparing the predictive power of two configurational entropy models extending the AGV approach;Andreozzi;Eur. Phys. J.B,2004
3. Gradient of glass transition temperature in filled elastomers;Berriot;Eur. Lett.,2003
4. Analysis of the isothermal mechanical response of a shape memory polymer rheological model;Bhattacharyya;Polym. Eng. Sci.,2000
5. Nanocapsules for self-healing materials;Blaiszik;Comp. Sci. Technol.,2008
Cited by 140 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Insight into constitutive theories of 4D printed polymer materials: a review;Smart Materials and Structures;2024-06-19
2. A thermo-mechanical, viscoelasto-plastic model for semi-crystalline polymers exhibiting one-way and two-way shape memory effects under phase change;International Journal of Solids and Structures;2024-06
3. A novel viscoelastic fractional damage model of thermosetting polymers for dynamic responses;Communications in Nonlinear Science and Numerical Simulation;2024-03
4. On Lightweight Shape Memory Vitrimer Composites;ACS Applied Polymer Materials;2023-12-15
5. Conductive and Ferromagnetic Syntactic Foam with Shape Memory and Self‐Healing/Recycling Capabilities;Advanced Functional Materials;2023-12-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3