The influence of CeO2 abrasive size on the performance of photocatalytic assisted chemical-mechanical polishing by Y/Pr co-doping strategy-Reference-Cited by-同舟云学术

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The influence of CeO2 abrasive size on the performance of photocatalytic assisted chemical-mechanical polishing by Y/Pr co-doping strategy

Published:2024-03 Issue: Volume:684 Page:133107
ISSN:0927-7757
Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
language:en
Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Xu Ning,Luo Yuxin,Lin Yu,Ma Jiahui,Pu Yongping

Publisher

Elsevier BV

Subject

Colloid and Surface Chemistry

Reference72 articles.

1. Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives;Liu;Appl. Surf. Sci.,2023

2. Atomic surface of fused silica and polishing mechanism interpreted by molecular dynamics and density functional theory;Liu;Mater. Today Sustain.,2023

3. Green chemical mechanical polishing of sapphire wafers using a novel slurry;Xie;Nanoscale,2020

4. A novel slurry for chemical mechanical polishing of single crystal diamond;Liao;Appl. Surf. Sci.,2021

5. Development of a novel chemical mechanical polishing slurry and its polishing mechanisms on a nickel alloy;Zhang;Appl. Surf. Sci.,2020

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