Synthesis, characterization and thermal analysis of urea–formaldehyde/nanoSiO2 resins-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Synthesis, characterization and thermal analysis of urea–formaldehyde/nanoSiO2 resins

Published:2012-01 Issue: Volume:527 Page:33-39
ISSN:0040-6031
Container-title:Thermochimica Acta
language:en
Short-container-title:Thermochimica Acta

Author:

Roumeli E.,Papadopoulou E.,Pavlidou E.,Vourlias G.,Bikiaris D.,Paraskevopoulos K.M.,Chrissafis K.

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference32 articles.

1. Urea–formaldehyde (UF) adhesive resins for wood;Dunky;Int. J. Adhes. Adhes.,1998

2. Differential scanning calorimetry of urea–formaldehyde adhesive resins, synthesized under different pH conditions;Park;J. Appl. Polym. Sci.,2006

3. Evaluation of three test methods in determination of formaldehyde emission from particleboard bonded with different mole ratio in the urea–formaldehyde resin;Que;Build. Environ.,2007

4. Effects of formaldehyde to urea mole ratio on thermal curing behavior of urea–formaldehyde resin and properties of particleboard;Park;J. Appl. Polym. Sci.,2006

Cited by 109 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A formaldehyde-free amino resin alternative to urea-formaldehyde adhesives: A bio-based oxidized glucose – urea resin;Industrial Crops and Products;2024-10

2. The effect of veneer-surface modification with fumed nanosilica on the selected properties of water-resistant plywood;Wood Material Science & Engineering;2024-07-30

3. Influence of Pressing Temperatures on Physical–Mechanical Properties of Wood Particleboards Made with Urea-Formaldehyde Adhesive Containing Al2O3 and CuO Nanoparticles;Polymers;2024-06-11

4. Phenol-formaldehyde resin enriched with graphene nanoplatelets as an electroconductive adhesive for wood composites;International Journal of Adhesion and Adhesives;2024-06

5. Study on surface grafting of hydroxyapatite and its influence on the properties of urea-formaldehyde resin;International Journal of Adhesion and Adhesives;2024-06

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3