Funder
ICRD Advanced Interconnect project
Shanghai IC R&D Center
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference24 articles.
1. Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes[J];Kumaresan;Microelectron. Eng.,2014
2. Low-k interconnect stack with multi-layer air gap and tri-metal-insulator-metal capacitors for 14nm high volume manufacturing[C];Fischer,2015
3. A kinetic decomposition process for air-gap interconnects and induced deformation instability of a low-k dielectric cap layer[J];Ryu;J. Mech. Sci. Technol.,2014
4. Advanced patterning approaches for Cu/Low-k interconnects;Tsai,2017
5. Middle of line RC performance study at the 7 nm node;Fan,2017