Role of abrasives in high selectivity STI CMP slurries-Reference-Cited by-同舟云学术

Role of abrasives in high selectivity STI CMP slurries

Published:2008-08 Issue:8 Volume:85 Page:1748-1753
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Manivannan R.,Ramanathan S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference44 articles.

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5. H. Kodama, S. Suzumura, N. Yokomuchi, S. Miura, H. Otake, A. Kawamura, M. Ito, US Patent 5,733,819 (1998).

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