Investigation on permeability of ultra-thin screen wick with free surface using gravity flow and numerical simulation methods-Reference-Cited by-同舟云学术

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Investigation on permeability of ultra-thin screen wick with free surface using gravity flow and numerical simulation methods

Published:2022-02 Issue: Volume:131 Page:105879
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Tan Si-Cong,Guo Cong,Jiang Yu-Yan,Wang Tao,Li Cheng-Zhan

Funder

National Natural Science Foundation of China

Beijing Institute of Technology Research Fund Program for Young Scholars

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference23 articles.

1. Review of applications and developments of ultra-thin micro heat pipes for electronic cooling;Tang;Appl. Energy,2018

2. Ultrahigh thermal conductive yet superflexible graphene films;Peng;Adv. Mater.,2017

3. Permeability of Ultra Thin Porous Materials by Poro-elastic Response;Unno,2019

4. Experimental investigation on working fluid selection in a micro pulsating heat pipe;Kim;Energy Convers. Manag.,2020

5. Experimental studies on a novel thin flat heat pipe heat spreader;Li;Appl. Therm. Eng.,2016

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A new investigation on permeability of multilayer stacked screen wick;International Communications in Heat and Mass Transfer;2024-11

2. Influence of vapor core design on thermal and hydraulic performance of mesh-type ultra-thin vapor chamber;Applied Thermal Engineering;2024-06

3. A dual-height wick to improve capillary performance of vapor chambers;Applied Thermal Engineering;2024-03

4. Numerical analysis on thermal hydraulic characteristics of mesh-type ultra-thin vapor chambers;Applied Thermal Engineering;2024-01

5. Permeability of Single‐Layer‐Free‐Standing Meshes at Varying Capillary Pressure via a Novel Method;Advanced Materials Interfaces;2023-07-24

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