The impact of the combination of xanthan gum and polyvinyl pyrrolidone (PVP) on the chemical mechanical polishing of through silicon via (TSV) barrier layer
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference37 articles.
1. CMP process development for the via-middle 3D TSV applications at 28 nm technology node (Conference Paper);Tsai;Microelectron. Eng.,2012
2. SALAH K., 2016. TSV-based 3D integration fabrication technologies: An overview, 2014 9th International Design and Test Symposium (idt), Algeries, Algeria, 2016: 253–256, https://doi.org/10.1109/IDT.2014.7038623.
3. GU S.Q., Ray U., Li Y., et al., 2010. 3D TSV integration technology challenges for high volume production from fabless supply chain aspect, 2010 Ieee International Interconnect Technology Conference. Burlingame, CA, USA: IEEE, 2010: 1–3, https://doi.org/10.1109/IITC.2010.5510309.
4. Behavior of palladium and its impact on intermetallic growth in palladium-coated Cu wire bonding;XU;Acta Mater.,2013
5. A novel approach of chemical mechanical polishing for a titanium alloy using an environment-friendly slurry;Zhang;Appl. Surf. Sci.,2018
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