Author:
Fuchs P.F.,Pinter G.,Tonjec M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Board level drop test method of components for handheld electronic products. JEDEC Standard JESD22-B111, No. July, 2003.
2. Impact life prediction modeling of TFBGA packages under board level drop test;Tee;Microelectron Reliab,2004
3. Optimization for simulation of WL-CSP subjected to drop-test with plasticity behavior;Le Coq;Microelectron Reliab,2011
4. Specification for finished fabric woven from ‘E’ glass for printed boards. IPC – 4412A Amendment 1; 2008.
5. Jawitz MW, Jawitz MJ. Materials for rigid and flexible printed wiring boards; 2007.
Cited by
26 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献