Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference33 articles.
1. Katopis GA. The evolution of ceramic packages for S/390 servers. In: Proceedings of pacific Rim/ASME international electron package, 2001. p. 13–20.
2. EDA challenges facing future microprocessor design;Kam;IEEE Trans Computer-Aided Des,2000
3. Thermal challenges in next generation electronic system-summary of panel presentations and discussions;Garimella;IEEE Trans Comput Packag Technol,2002
4. Electronic system packaging: the search for manufacturing the optimum in a sea of constraints;Moresco;IEEE Trans Comput Hybr Manufact Technol,1990
5. Conceptual design of multichip modules and systems;Sandborn,1994
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