Module packaging effects on MEMS airbag sensor performance for automobiles-Reference-Cited by-同舟云学术

Module packaging effects on MEMS airbag sensor performance for automobiles

Published:2017-12 Issue: Volume:79 Page:328-335
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Park Dong Hyun,Shin Sojin,Kim Yeong K.

Funder

Inha University

Korean Ministry of Trade, Industry and Energy

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Current trends and future directions in MEMS;Pryputniewicz;Exp. Mech.,2012

2. The future of microelectromechanical systems (MEMS);Marinis;Strain,2009

3. Sensors for automotive telematics;Turner;Meas. Sci. Technol.,2000

4. Challenges in the packaging of MEMS;Marshe;Int. J. Microcircuits Electron Packag.,1999

5. Mems packaging issues and materials;Gilleo;Adv. Microelectron.,2000

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