Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. Electronic Materials and Process Handbook;Harper,1993
2. Lin YC. Materials for optoelectronic device packaging/manufacturing. PhD dissertation. University of California, Irvine; 2007.
3. Prediction of the epoxy moulding compound aging effect on package reliability;Noijen;Microelectron Reliab,2010
4. Glass transition temperature as a function of conversion in thermosetting polymers;Hale;Macromolecules,1991
5. Effect of curing history on ultimate glass transition temperature and network structure of crosslinking polymers;Chang;Polymer,1992
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