Effect of filler concentration of rubbery shear and bulk modulus of molding compounds
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Publisher
Elsevier BV
Reference12 articles.
1. Residual stress build-up in thermoset films cured above their ultimate glass transition temperature;Lange;Polymer,1995
2. A rubbery cure shrinkage model for analyzing encapsulated assemblies;Chambers;J Electron Packaging,1995
3. Verification of the capability for quantitative stress prediction during epoxy cure;Adolf;Polymer,1997
4. Modeling the evolution of the dynamic mechanical properties of a commercial epoxy during cure after gelation;Simon;J Appl Polymer Sci,2000
5. Wang HY, et al. Mechanical modeling of Underfills based on two-phase composites. In: Proceedings of 49th ECTC, 1999.
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