Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test-Reference-Cited by-同舟云学术

Interfacial reaction and mechanical evaluation in multi-level assembly joints with ENEPIG under bump metallization via drop and high speed impact test

Published:2015-01 Issue:1 Volume:55 Page:231-237
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lin Hsiu-Min,Ho Cheng-Ying,Chen Wen-Lin,Wu Yi-Hsin,Wang De-Hui,Lin Jun-Ren,Wu Yu-Hui,Hong Huei-Cheng,Lin Zhi-Wei,Duh Jenq-Gong

Funder

National Science Council Taiwan

Publisher

Elsevier BV

Reference25 articles.

1. Impact testing of Sn–3.0Ag–0.5Cu solder with Ti/Ni(V)/Cu under bump metallization after aging at 150°C;Wang;J Electron Mater,2010

2. Suppressing the growth of interfacial Cu–Sn intermetallic compounds in the Sn–3.0Ag–0.5Cu–0.1Ni/Cu–15Zn solder joint during thermal aging;Chen;J Mater Sci,2012

3. Interfacial reactions of Sn–3.0Ag–0.5Cu solder with Cu–Mn UBM during aging;Tseng;J Electron Mater,2010

4. Interfacial reaction between Sn–3.0Ag–0.5Cu liquid solder and Ni–xZn novel UBM layer;Lin;Surf Coat Technol,2011

5. Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizations;Lin;Microelectron Reliab,2012

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1. Research progress in diffusion barrier for advanced electronic packaging;CAILIAO GONGCHENG;2023

2. A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Reliability of laser soldering using low melting temperature eutectic Sn Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad;Materials Characterization;2022-12

4. Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn–3.0Ag–0.5Cu solder joints under isothermal aging;Journal of Materials Science: Materials in Electronics;2021-09-06

5. Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock;Journal of Materials Science: Materials in Electronics;2021-02-16