Author:
Kawashiro Fumiyoshi,Takao Kentaro,Kobayashi Tatsuya,Yoshikawa Masaaki,Miyake Eitaro,Endo Yoshiki,Tonedachi Tatsuo,Nishikawa Hiroshi
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference22 articles.
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3. Reliability modeling of Sn–Ag transient liquid phase die-bonds for high-power SiC devices
4. Proc. PCIM Europe;Konno,2016
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