High-cycle fatigue life prediction for Pb-free BGA under random vibration loading

Author:

Yu Da,Al-Yafawi Abdullah,Nguyen Tung T.,Park Seungbae,Chung Soonwan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference25 articles.

1. Combining vibration test with finite element analysis for the fatigue life estimation of PBGA components;Chen;Microelectron Reliab,2008

2. Vibration reliability test and finite element analysis for flip chip solder joints;Che;Microelectron Reliab,2009

3. Perkins A, Sitaraman SK. Vibration-induced solder joint fatigue failure of a ceramic column grid array (CCGA) package. In: Proc 54th electronic components and technology conference, Las Vegas; June 2004.

4. Vibration reliability characterization of PBGA assembly;Yang;Microelectron Reliab,2000

5. Pitarresi JM. Modeling of printed circuit cards subject to vibration. In: IEEE proceedings of the circuits and systems conference, New Orleans, LA; May 3–5, 1990. p. 2104–7.

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