Author:
Cheng Hsien-Chie,Hsieh Kun-Yu,Chen Kuo-Ming
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Failure analysis of pad-height effects in the fine-pitch interconnection of the anisotropic conductive films;Lin;Microelectron Reliab,2008
2. A study of process-induced deformations of anisotropic conductive film (ACF) assembly;Cheng;IEEE Trans Compon Packag Technol,2006
3. A new anisotropic conductive film with arraryed conductive particles;Ishibashi;AMP J Technol,1996
4. Yamaguchi M, Asai F, Eriguchi F, Hotta Y. Development of novel anisotropic conductive film (ACE). In: Proc 1999 IEMT/IMC symposium, April 21–23, Sonic City, Omiya (Japan); 1999.
5. Hatada K, Fujimoto H, Kawakita T, Ochi T. A new LSI bonding technology: micro bump bonding assembly technology. In: Proc IEEE-CHMT; 1988. p. 45–9.
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献