Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps-Reference-Cited by-同舟云学术

Fabrication and thermal analysis of flip-chip light-emitting diodes with different numbers of Au stub bumps

Published:2010-05 Issue:5 Volume:50 Page:683-687
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Lin Cheng-Chen,Chang Liann-Be,Jeng Ming-Jer,Yen Chia-Yi,Das Atanu,Tang Chung-Yi,Tsai Ming-Yi,Lai Mu-Jen

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

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2. Improvement of light extraction efficiency of flip-chip light-emitting diode by texturing the bottom side surface of sapphire AlN submount;Han;IEEE Photon Technol Lett,2006

3. Fabrication and thermal analysis of wafer-level light-emitting diode packages;Kang;IEEE Electron Device Lett,2008

4. High-power AlGaInN flip-chip light-emitting diodes;Wierer;Appl Phys Lett,2001

5. Electrical, optical and thermal degradation of high power GaN/InGaN light-emitting diodes;Hu;J Phys D, Appl Phys,2008

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