Author:
Lederer M.,Gökdeniz Z.,Khatibi G.,Nicolics J.
Funder
Christian Doppler Forschungsgesellschaft
Bundesministerium für Digitalisierung und Wirtschaftsstandort
Österreichische Nationalstiftung für Forschung, Technologie und Entwicklung
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. An innovative method for joining materials at low temperature using silver (nano)particles derived from [AgO2C(CH2OCH2)3H];Oestreicher;Appl. Surf. Sci.,2013
2. nnovative and reliable power modules;Neeb;IEEE Ind. Electron. Mag.,2014
3. Embedded die packages and modules for power electronics applications;Boettcher;IMAPS,2016
4. Behaviour of silver-sintered joints by cycling mechanical loading and influence of temperature;Gökdeniz,2019
5. 41st International Spring Seminar on Electronics Technology (ISSE);Gökdeniz,2018
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