1. An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage;Frewein,2022
2. Pressing simulations within the PCB manufacturing framework;Schipfer,2022
3. IPC International, Inc;World PCB production report for the year,2017
4. Board-level reliability performance of enterprise and datacenter SSD form factor (EDSFF);Lau,2021
5. Numerical simulation and characterization of PCB warpage;Hamid,2022