Enhanced solder fatigue life of chip resistor by optimizing solder shape-Reference-Cited by-同舟云学术

Enhanced solder fatigue life of chip resistor by optimizing solder shape

Published:2023-06 Issue: Volume:145 Page:114994
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ha Jonghwan,Lai Yangyang,Yang Junbo,Yin Pengcheng,Park Seungbae

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference41 articles.

1. Reliability Simulations for Solder Joints Using Stochastic Finite Element and Artificial Neural Network Models;Subbarayan,1996

2. A Procedure for Automated Shape and Life Prediction in Flip-chip and BGA Solder Joints;Subbarayan,1996

3. Maximizing Solder Joint Reliability Through Optimal Shape Design;Deshpande,1997

4. The Nature of Centroidal Locus in Misaligned Flip-chip Solder Joints;Subbarayan,1997

5. The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints;Li,1998

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1. Reliability and thermal fatigue life prediction of solder joints using nanoindentation;Materials Today Communications;2024-06

2. Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Reliability of Differently Shaped Solder Joints in Chip Resistor Under Drop Impact;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28