Investigating failure mode and mechanism of copper ribbon interconnections in operating photovoltaic modules-Reference-Cited by-同舟云学术

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Investigating failure mode and mechanism of copper ribbon interconnections in operating photovoltaic modules

Published:2023-11 Issue: Volume:150 Page:115094
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Delmonte N.,Santoro D.,Provenzale L.,Cova P.

Publisher

Elsevier BV

Reference7 articles.

1. Review of Failures of Photovoltaic Modules. External Final Report IEA-PVPS;Köntges,2014

2. A review of the degradation of photovoltaic modules for life expectancy;Kim;Energies,2021

3. Review of degradation and failure phenomena in photovoltaic modules;Aghaei;Renew. Sust. Energ. Rev.,2022

4. Comparison of module temperature measurement methods;Krauter,2009

5. Interconnection Technologies for Photovoltaic Modules - Analysis of Technological and Mechanical Problems, Proc. EuroSimE 2010, April 26–28;Rendler,2010

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization;International Journal of Manufacturing, Materials, and Mechanical Engineering;2023-11-14

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