Detection of cracks in multilayer ceramic capacitors by X-ray imaging-Reference-Cited by-同舟云学术

Detection of cracks in multilayer ceramic capacitors by X-ray imaging

Published:2016-09 Issue: Volume:64 Page:352-356
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Andersson C.,Ingman J.,Varescon E.,Kiviniemi M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Flex cracking of multilayer ceramic capacitors assembled with Pb-free and Tin-Lead solders;Keimasi;IEEE Transactions on Device and Materials Reliability,2008

2. Detection of cracked multi-layer ceramic capacitors on printed circuit board assemblies;Azarian,2014

3. Board Flex Test;AEC-Q200-005A standard,2010

4. Monotonic Bend Characterization of Board.Level Interconnects;IPC/JEDEC-9702A standard,2004

5. Printed Circuit Assembly Strain Gage Test Guideline;IPC-JEDEC9704A standard,2012

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