Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads-Reference-Cited by-同舟云学术

Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads

Published:2016-07 Issue: Volume:62 Page:148-155
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Fellner Klaus,Antretter Thomas,Fuchs Peter F.,Tao Qi

Funder

Austrian Government

State Governments of Styria, Lower Austria and Upper Austria

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference36 articles.

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4. Thermal Shock;JESD22-A106B,2004

5. Accuracy of simplified printed circuit board finite element models;Amy;Microelectron. Reliab.,2010

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