Thermal analysis of a flip chip ceramic ball grid array (CBGA) package-Reference-Cited by-同舟云学术

Thermal analysis of a flip chip ceramic ball grid array (CBGA) package

Published:2008-02 Issue:2 Volume:48 Page:261-273
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kandasamy Ravi,Mujumdar A.S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

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2. Mark A et al. Aluminium silicon carbide (AlSiC) microprocessor lids and heatsinks for integrated thermal management solutions. Colorado: HDI Conference 2000.

3. Developing an equivalent thermal model for discrete semiconductor packages;Ammous;Int J Therm Sci,2003

4. EIA/JESD-51-2. Integrated circuits thermal test method environmental conditions – natural convection (still air), 1995.

5. EIA/JESD 51-6. Integrated circuits thermal test method environmental conditions – forced convection (moving air), 1999.

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