Author:
Nie Chuanjun,Xu Qinzhi,Chen Lan
Funder
Chinese Academy of Sciences
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. System-on-chip: reuse and integration;Saleh;Proc. IEEE,2006
2. Demystifying 3D ICs: the pros and cons of going vertical;Davis;IEEE Des. Test Comput.,2005
3. Architecture, chip, and package codesign flow for interposer-based 2.5-D chiplet integration enabling heterogeneous IP reuse;Kim;IEEE Trans. Very Large Scale Integr. VLSI Syst.,2020
4. Heterogeneous integration for performance and scaling;Iyer;IEEE Trans. Compon. Packag. Manuf. Technol.,2016
5. Implementing System-in-Package with Nanophotonic Interconnect, Workshop on the Interaction between Nanophotonic Devices and Systems;Cianchetti,2010
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献