Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics-Reference-Cited by-同舟云学术

Towards electro-thermo-mechanical lifetime assessment for arbitrary power electronics

Published:2022-06 Issue: Volume:133 Page:114537
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Gschwandl Mario,Friedrich Birgit,Pfost Martin,Antretter Thomas,Fuchs Peter Filipp,Mitev Ivaylo,Tao Qi,Schingale Angelika

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. Toward reliable power electronics: challenges, design tools, and opportunities;Wang;IEEE Ind. Electron. Mag.,2013

2. Gallium-nitride semiconductor technology and its practical design challenges in power electronics applications: an overview;Vecchia;Energies,2019

3. Automotive power electronics. new challenges for power electronics;Schoner,2000

4. Advanced composites and other advanced materials for electronic packaging thermal management;Zweben,2001

5. PC board thermal management of high power LEDs;Yu,2008

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