Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi-Reference-Cited by-同舟云学术

Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi

Published:2022-12 Issue: Volume:139 Page:114802
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Jaffery Syed Hassan Abbas,Sabri Mohd Faizul Mohd,Rozali Shaifulazuar,Hasan Syed Waqar,Mahdavifard Mohammad Hossein,AL-Zubiady Dhafer Abdul-ameer Shnawah,Ravuri Balaji Rao

Funder

Universiti Malaya

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference48 articles.

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3. Microstructure of Sn–1Ag–0.5 cu solder alloy bearing fe under salt spray test;Nordin;Microelectron. Reliab.,2014

4. Effects of doping trace ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints;Wang;Soldering Surf. Mount Technol.,2022

5. Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array;Garcia;Mater. Charact.,2010

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